Subminiature High Performance AlInGaP LED Lamps

Flat Top Package
The HLMA-PL00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.

Lead Configurations
All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more infor-mation refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps data sheet.

Technology
These subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies, the absorbing substrate carrier technology (AS = HLMA-Devices).